{"created":"2024-07-10T02:40:15.677848+00:00","id":2000538,"links":{},"metadata":{"_buckets":{"deposit":"84951a92-dbdc-4bbb-b333-d8a3f9e4e69c"},"_deposit":{"created_by":11,"id":"2000538","owner":"11","owners":[11],"pid":{"revision_id":0,"type":"depid","value":"2000538"},"status":"published"},"_oai":{"id":"oai:hirosaki.repo.nii.ac.jp:02000538","sets":["375:380:1720412039843"]},"author_link":["21127","19994"],"item_5_biblio_info_8":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2024-03-27","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"100","bibliographicPageStart":"97","bibliographicVolumeNumber":"131","bibliographic_titles":[{"bibliographic_title":"弘前大学教育学部紀要","bibliographic_titleLang":"ja"}]}]},"item_5_description_5":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"りんご剪定枝をチップ化，粉末化し，作製した粉末を用いてバインダーレスボードを作製，その物性を評価した。具体的には，大型チッパーを用いてチップを作製し，ウイレー粉砕機で粉砕したりんご剪定枝粉末の含水率を調整し，熱プレスを行った。その後，得られた粉末やバインダーレスボードの物性を調べた。その結果，作製したりんご剪定枝粉末は300μmのふるい上に残った粉末が最も多く，作製したバインダーレスボードの硬さは150℃で作製したバインダーレスボードが最大となった，また，曲げ強度は175℃で作製したバインダーレスボードが最も高かった。","subitem_description_language":"ja","subitem_description_type":"Abstract"}]},"item_5_full_name_3":{"attribute_name":"著者別名","attribute_value_mlt":[{"names":[{"name":"Mitsutoshi, 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